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Analysis of Embedded Package Capacitors for High Performance Components

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7 Author(s)

The ever increasing power requirements of processors and application specific integrated circuits (ASICs) impose stringent requirements on the design of power distribution networks (PDNs). This paper highlights a power analysis methodology and discusses the decoupling requirements of high performance components. The advantages of embedded package capacitors in core and I/O decoupling will be highlighted

Published in:

Electrical Performance of Electronic Packaging, 2006 IEEE

Date of Conference:

Oct. 2006

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