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Characterization and Modeling of Wire Bond Interconnects up to 100 GHz

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4 Author(s)
Jahn, D. ; TSO Technol. Solutions Organ., Freescale Halbleiter GmbH, Munich ; Reuter, R. ; Yi Yin ; Feige, J.

This paper presents a model for single and multiple wire bond interconnects for the frequency range from 200 MHz up to 100 GHz, usable in agilents advanced design system (ADS). Test structures for on-wafer s-parameter characterization have been developed. Equivalent circuits for single- and multiple wire bond connections are derived, respectively. The small-signal elements of the equivalent circuit are based on physical parameters and scalable with the bond wire distance and length. The model demonstrates an excellent agreement with measurements in broad frequency range

Published in:

Compound Semiconductor Integrated Circuit Symposium, 2006. CSIC 2006. IEEE

Date of Conference:

Nov. 2006