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A model for verification of coupled high-speed packages and interconnects

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2 Author(s)
Simsek, A. ; Tech. Univ. Berlin, Germany ; Eder, A.

A method for verification of the interconnect system design for high-speed and high-density packages is described. To predict design tradeoffs the pertinent parameters are first determined. The electrical behaviors of the interconnects are simulated, and the results of coupling effects are discussed. A new modular SPICE-model has been developed which represents coupled multiconductors. This model can be used to analyze signal distortion and ground-bounce. With this model the SPICE code can be significantly reduced

Published in:
ASIC Conference and Exhibit, 1993. Proceedings., Sixth Annual IEEE International

Date of Conference: 27 Sep-1 Oct 1993

Page(s):
538 - 541
Meeting Date :
27 Sep 1993-01 Oct 1993
Print ISBN:
0-7803-1375-5
INSPEC Accession Number:
4985876
Conference Location :
Rochester, NY
Digital Object Identifier :
10.1109/ASIC.1993.410841
Product Type:
Conference Publications

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