By Topic

New 3DP Process Technique of SFF System Using a Photopolymer Resin and a Powder

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Jung-Su Kim ; Dept. of Mech. & Intelligent Syst. Eng., Pusan Nat. Univ. ; Min-Cheol Lee ; Won-Hee Lee ; Kim, Dong-Soo

SFF system could quickly makes models and prototype parts from 3D computer-aided design (CAD) data. SFF system in the office environment is a tool that streamlines and expedites the product development process. The 3DP technology is one of SFF(solid freeform fabrication) technologies which have recently came into the spotlight and are being applied to various fields. This process has the advantage of the fast manufacture time. But conventional 3DP process needs the post-process necessarily and a part fabricated by this process has too low strength. So we proposed a new 3DP process to reduce post-process time and fabricate a part with high strength and construct a SFF system. In this study, we constructed the SFF system using a photopolymer resin and a powder. We used the piezo printhead for the printing of the UV resin on the slice contour and experimented the curing of photopolymer resin in the powder based 3DP system

Published in:

SICE-ICASE, 2006. International Joint Conference

Date of Conference:

18-21 Oct. 2006