Referenced Items are not available for this document.
Compared to conventional packaging, multichip modules have significantly reduced capacitive loading in their interconnections. The authors present experimental results showing the performance of I/O buffers specially designed to operate in this environment, evaluated in several different silicon-on-silicon test modules
Published in:
ASIC Conference and Exhibit, 1993. Proceedings., Sixth Annual IEEE International
Date of Conference: 27 Sep-1 Oct 1993
- Page(s):
- 464 - 467
- Meeting Date :
- 27 Sep 1993-01 Oct 1993
- Print ISBN:
- 0-7803-1375-5
- INSPEC Accession Number:
- 4985860
- Conference Location :
- Rochester, NY
- Digital Object Identifier :
- 10.1109/ASIC.1993.410760
- Product Type:
- Conference Publications
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