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Performance evaluation of MCM chip-to-chip interconnections using custom I/O buffer designs

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5 Author(s)
Frye, R.C. ; AT&T Bell Lab., Murray Hill, NJ, USA ; Gabara, T.J. ; Tai, K.L. ; Fischer, W.C.
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Compared to conventional packaging, multichip modules have significantly reduced capacitive loading in their interconnections. The authors present experimental results showing the performance of I/O buffers specially designed to operate in this environment, evaluated in several different silicon-on-silicon test modules

Published in:

ASIC Conference and Exhibit, 1993. Proceedings., Sixth Annual IEEE International

Date of Conference:

27 Sep-1 Oct 1993