IEEE.org| IEEE Xplore Digital Library| IEEE Standards| IEEE Spectrum| More Sites

Cart (Loading....) | Create Account | 

Close category search window
Author Searchbeta |  Advanced Search  |  Preferences |  Search Tips  |  More Search Options  
 
Browse Conference Publications > Microsystems, Packaging, Asse ... Help

A Numerical Study of Board-level Stacked-die Packages Under Coupled Power and Thermal Cycling Test Conditions

Full Text Sign-In or Purchase

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing! close button
puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Tong Hong Wang ; Advanced Semicond. Eng. Inc., Kaohsiung ; Chang-Chi Lee ; Ching-Chun Wang ; Yi-Shao Lai

In this study, the sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of board-level stacked-die thin-profile fine-pitch ball grid array chip-scale packages under coupled power and thermal cycling test conditions. Effects of different power dissipation conditions are examined and compared

Published in:
Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International

Date of Conference: 18-20 Oct. 2006

Page(s):
1 - 4
E-ISBN :
1-4244-0735-4
Print ISBN:
1-4244-0735-4
INSPEC Accession Number:
9473689
Conference Location :
Taipei
Digital Object Identifier :
10.1109/IMPACT.2006.312205
Product Type:
Conference Publications

IEEE Account

Purchase Details

Profile Information

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.