A Numerical Study of Board-level Stacked-die Packages Under Coupled Power and Thermal Cycling Test Conditions

In this study, the sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of board-level stacked-die thin-profile fine-pitch ball grid array chip-scale packages under coupled power and thermal cycling test conditions. Effects of different power dissipation conditions are examined and compared