Close category search window
 

A Simple Model Predicting Transient Thermal Management of PEMFC and Cooling System

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Jong Hoon Jang ; Sch. of Mech. & Automotive Eng., Ulsan Univ.

A simple model is developed to predict the dynamic temperature variations of PEMFC (proton exchange membrane fuel cell) and its cooling system for automotive applications. A lumped heat capacity method (LHCM) is used to model, but the governing equations for the fuel cell stack, radiator, cooling water, and air are conjugated. The model predicts the transient temperatures of the fuel cell stack, radiator, cooling water, and air for stepwise power changes. Parametric studies show that the increase in the heat transfer coefficient of the cooling water at the radiator is more effective to cool the fuel cell than that at the fuel cell. The increase of the air flow rate at the radiator decreases the operating temperature of the system. This simple model could be a useful tool to decide the dimension of each component of the system for required power.

Published in:
Strategic Technology, The 1st International Forum on

Date of Conference: 18-20 Oct. 2006

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.