Efficient method for the capacitance calculation of circularly symmetric via in multilayered media

The equivalent capacitance produced by a circularly symmetric via connecting two microstrip lines on different planes is efficiently calculated by using the rectangular boundary division method. The calculation is carried out considering effects of inhomogeneous media within the line structures as well as the ground conductor thickness on the capacitance produced by a microstrip via. Computational results for various via geometries are presented and compared with presently available data.<
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