Cart (Loading....) | Create Account
Close category search window

Packaging design of wide-angle phased-array antenna for frequencies above 20 GHz

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Riemer, D. ; Defense & Space Group, Boeing Co., Seattle, WA, USA

Mechanical aspects of a new phased-array antenna design with a scan angle of ±70 degrees are presented. New packaging concepts were needed to accomplish, an industry first, the fabrication of a 91-element 44-GHz transmit array. The array architecture uses one hybrid module per channel. The RF signal is radiatively coupled to the modules, eliminating RF connectors. Multilayer boards are used to distribute control signals and DC which are connected to each module with space-efficient elastomeric connectors. All connections are made during the assembly of the array without need for permanent bonding. The array is designed for a low conductive thermal impedance from the monolithic microwave integrated circuits (MMIC) chips to the back of the array, where the heat is removed by convection

Published in:

Antennas and Propagation, IEEE Transactions on  (Volume:43 ,  Issue: 9 )

Date of Publication:

Sep 1995

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.