A Wafer-level Protective Technique Using Glass Caps for MEMS Gyroscopes

MEMS gyroscopes are easily damaged and contaminated in dicing, test, transportation and storage due to their fragile movable structures and small feature size. A wafer-level protective technique is developed by directly bonding a glass cap on the fabricated gyroscope. The protective packaging is based on the silicon glass anodic-bonding and deep etching release (SGADER) process. Preliminary testing is carried out to study the reliability and yield of the protective packaging technique, and the results show that a great improvement has been achieved