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A Wafer-level Protective Technique Using Glass Caps for MEMS Gyroscopes

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5 Author(s)
Haitao Ding ; Inst. of Microelectron., Peking Univ., Beijing ; Zhenchuan Yang ; Zhiyong Chen ; Rong Zhang
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MEMS gyroscopes are easily damaged and contaminated in dicing, test, transportation and storage due to their fragile movable structures and small feature size. A wafer-level protective technique is developed by directly bonding a glass cap on the fabricated gyroscope. The protective packaging is based on the silicon glass anodic-bonding and deep etching release (SGADER) process. Preliminary testing is carried out to study the reliability and yield of the protective packaging technique, and the results show that a great improvement has been achieved

Published in:

Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on

Date of Conference:

23-26 Oct. 2006