Cart (Loading....) | Create Account
Close category search window
 

Integrated optical waveguides in polyimide for wafer scale integration

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Selvaraj, R. ; Center for Integrated Electron., Rensselaer Polytech. Inst., Troy, NY, USA ; Lin, H.T. ; McDonald, J.F.

Optical interconnections promise several key advantages over their electrical counterparts such as large bandwidth and reduced propagation delay. The limitations of electrical interconnections become even more significant for wafer scale integration (WSI), and wafer scale hybrid packaging (WSHP) because of the length of wafer scale interconnections. The authors investigate the possibility of using optically transparent organic dielectrics such as certain polyimides as waveguide materials for integrated optical waveguides, and the use of a focused ion beam (FIB) for micromachining optical structures such as mirrors

Published in:

Lightwave Technology, Journal of  (Volume:6 ,  Issue: 6 )

Date of Publication:

Jun 1988

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.