By Topic

On-Chip Communication in Run-Time Assembled Reconfigurable Systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Sedcole, P. ; Dept. of Electr. & Electron. Eng., Imperial Coll., London ; Cheung, P.Y.K. ; Constantinides, G.A. ; Luk, W.

Embedded systems in field-programmable gate arrays can be customised and adaptive if assembled from modular components at run time. This paper describes techniques for modelling inter-module channel behaviour based on statistical time division multiplexing. Where modules communicate over shared media, the proposed techniques enable systematic development of on-chip communication infrastructure to support run-time instantiation of components. Our techniques also allow system designers to guarantee that logical communication requirements between the adjunct modules can be satisfied by the infrastructure. An in-depth analysis is presented, and then verified with cycle-accurate simulations for the Sonic-on-chip reconfigurable platform for real-time video applications

Published in:

Embedded Computer Systems: Architectures, Modeling and Simulation, 2006. IC-SAMOS 2006. International Conference on

Date of Conference:

July 2006