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Design and Fabrication of a High Performance LDMOSFET with Step Doped Drift Region on Bonded SOI Wafers

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3 Author(s)
Yufeng Guo ; Coll. of Optioelectronic Eng., Nanjing Univ. of Posts & Telecommun., Nanjing ; Zhaoji Li ; Bo Zhang

The SOI LDMOSFETs with step doping profiles in drift region have been experimentally investigated. Uniform, single-step and two-step doped drift regions have been designed and fabricated on a same bonded SOI wafer with the top silicon layer of 3 mum and buried oxide layer of 1.5 mum. The experimental devices with two-step doping profile have a breakdown voltage in access of 250 V and specific on-resistance of 1.6 Omegamm2. Furthermore, the breakdown characteristic and forward conduction characteristic for the various step doping profiles were measured and compared. The results show two-step doping can enable increase in the breakdown voltage by 40% and decrease in on-resistance by 16% in comparison to the conventional uniformly doped drift device.

Published in:

Communications, Circuits and Systems Proceedings, 2006 International Conference on  (Volume:4 )

Date of Conference:

25-28 June 2006