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Improvement of the Adhesive Bond Strength between Metals and Polymers by Plasmachemical and Wet-chemical Pretreatments

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2 Author(s)
Friedrich, J. ; Fed. Inst. of Mater. Res. & Testing, Berlin ; Mix, R.

Several adhesion problems between metal layers and polymers exist in various electronic assemblies due to the deficiency or absence of strong covalent bonds associated with the strongly different thermal expansion coefficients of the materials. Here, ways are described to establish well-defined covalent bonds at the interfaces. Additionally, unwished redox-reactions between metals, metal oxides and polymers can disturb covalent bonds and therefore the adhesive bond strength

Published in:

Electronics Systemintegration Technology Conference, 2006. 1st  (Volume:2 )

Date of Conference:

5-7 Sept. 2006