By Topic

Cure Shrinkage and Bulk Modulus Determination for Moulding Compounds

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Saraswat, M.K. ; Delft Univ. of Technol. ; Jansen, K.M.B. ; Ernst, L.J.

In the electronic industry thermoset polymers are used as moulding compounds, underfill materials coatings and adhesives. A good knowledge of the cure shrinkage and material properties is needed to do reliable predictions of the stresses induced during packaging. In this paper, a novel technique using a new PVT (pressure-volume-temperature) apparatus is applied for measuring these quantities. The PVT apparatus can measure specific volume changes of the order of plusmn10-3 cm3 /g with a programmable temperature range of 20-400degC and pressure range of 0-200MPa. A hybrid approach is then used together with differential scanning calorimeter (DSC) measurements for the kinetic modeling of these thermoset systems. The results show that the actual shrinkage during curing can reach values as high as 3.5% by volume for an unfilled epoxy Novolac system. It is furthermore shown that the common shrinkage definition which compares the specific volumes at room temperature before and after curing underestimates the actual shrinkage at the curing temperature by a factor of about 6. In addition a bulk modulus versus temperature curve was established. The bulk modulus was seen to drop by a factor of 1.5 during the glass transition

Published in:

Electronics Systemintegration Technology Conference, 2006. 1st  (Volume:2 )

Date of Conference:

5-7 Sept. 2006