By Topic

New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Johan Liu ; SMIT Center, Univ. of Technol., Goteborg ; Olorunyomi, M.O. ; Xiuzhen Lu ; Wen Xuan Wang
more authors

The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. The present research work aims at developing a new class of nano-thermal interface material (nanoTIM) that has low thermal resistance, high thermal conductivity and mechanical strength using the electrospinning process. With the electrospinning process, polymer nano-fibers with nano-scale diameter are formed. Nano-particles such as nano-silver particles, nano-carbon nanotubes (CNT) and nano-silicon carbide particles were embedded into the nano-fibers to enhance the thermal conductivity and to reduce the thermal resistivity. Optical and scanning electron microscopy (SEM) analysis techniques were used to determine the morphology of the nano-composite fibers obtained. Thermal resistivity, conductivity and mechanical strength of the nano-composite materials formed were measured. In addition, the manufactured nano-materials were characterized using the thermo gravimetric analyzer (TGA) and the differential scanning calorimetric (DSC) analysis techniques to study the softening, melting as well as degradation behavior. The mechanical strength was also studied using a multi-functional mechanical tester. The results show that the nano-fiber based composite nano-TIMs have similar thermal conductivity, 3 to 9 times lower thermal resistivity, similar operation temperature range and degradation behavior, 2 to 5 times higher ultimate tensile strength, in comparison with commercially available TIMs. By adding adhesive functions into the process, a new class of nano-TIM tape has been produced

Published in:

Electronics Systemintegration Technology Conference, 2006. 1st  (Volume:1 )

Date of Conference:

5-7 Sept. 2006