By Topic

Influence of the Thermal Treatment During the Saw Damage Etching Process on the Mechanical Stability of Multicrystalline Silicon Wafers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
D. Borchert ; Fraunhofer Institute for Solar Energy Systems (ISE), Laboratory-and Servicecenter Gelsenkirchen, Auf der Reihe 2, D-45884 Gelsenkirchen, phone +49-209-15539-11, e-mail ; S. Riepe ; R. Kubler ; J. Beinert
more authors

The influence of the thermal treatment during the saw damage etching process on the mechanical stability of multicrystalline silicon wafers has been investigated for four different alkaline saw damage etching procedures. After the different etching procedures the mechanical stabilities of the multicrystalline wafers have been measured using the concentric ring test and the four-point-bending test. The experimental results are compared to those obtained by numerical simulations

Published in:

2006 IEEE 4th World Conference on Photovoltaic Energy Conference  (Volume:1 )

Date of Conference:

7-12 May 2006