A rugged flip-chip technology with potential for low cost at high manufacturing volume was employed to fabricate on a single substrate a frequency-quadrupling LO chain that had previously required a total of twelve wire-bonded chips in MMIC technology. A four-to-one reduction in the number of bond wires was achieved. Measurements on a typical circuit showed an output power of 17 plusmn 1 dBm over an output frequency range of 34 to 40 GHz and an input power range of 1 to 19 dBm. Spurious signal power was under -23 dBm. Self-regulating biasing with built-in bypassing simplifies the unit's application
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Microwave Conference, 2006. 36th European
Date of Conference: 10-15 Sept. 2006