By Topic

A Low Cost Packaging Solution for Microwave Applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Wormald, R. ; Filtronic, West Yorkshire ; David, S. ; Panaghiston, G. ; Jeffries, R.

Lower cost solutions for packaging GaAs pHEMT devices, MMIC's and multi chip modules (MCM's) are now an essential requirement for high-rel military applications. This is very apparent in phased array applications where a large number of modules can have significant cost implications. A potential, novel, near hermetic and cost effective packaging solution, available in low to medium volumes, using liquid crystal polymer (LCP) laminates and conventional PCB manufacturing techniques is discussed

Published in:

European Microwave Integrated Circuits Conference, 2006. The 1st

Date of Conference:

10-13 Sept. 2006