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Low-Cost Hybrid Photonic Integrated Circuits using Passive Alignment Techniques

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1 Author(s)
Maxwell, G. ; CIP Ltd., Martlesham Heath, Ipswich

This paper describes a platform approach to achieve passive assembly of single-mode photonic components with high performance and low cost. The platform uses mode expanded and precision cleaved active semiconductor devices which are then passively assembled on PLC motherboards

Published in:

Lasers and Electro-Optics Society, 2006. LEOS 2006. 19th Annual Meeting of the IEEE

Date of Conference:

Oct. 2006