By Topic

Impact of process monitoring in semiconductor manufacturing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Wong, C.Y. ; IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA ; Hood, S.J.

Short cycle time in manufacturing leads to not only fast problem recognition and verification of solutions, reduction in partially finished product inventories and the final product costs, but most importantly, it provides a key vehicle for early market entry of the technology products. In contrast, deep-submicron CMOS usually involves processes with high complexity and tight process tolerance. By necessity, this dictates frequent process monitoring with send ahead test wafers in order to assure accelerated yield learning during early phases of manufacturing. However these send ahead test wafers, although beneficial in the overall yield improvement, will increase the total raw (theoretical) process time and decrease the equipment availabilities for real processing in the line. In this paper, we examine the impact of send ahead rest wafers on process cycle time, wafer throughput, and fab line equipment capacity requirements. Discrete Event Simulation was used to run a hypothetical fab model with an industry standard CMOS base process. Examples will be given for fab sizes ranging from early manufacturing 50 wafer starts per day to high volume 600 wafer starts per day. We will demonstrate that with careful planning in equipment capacity ramping in early manufacturing phases, send ahead process monitoring can be practised without lengthening the cycle time, decreasing the line throughput, and placing any additional burdens in the total cost of capital investment in the fab line

Published in:

Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International

Date of Conference:

12-14 Sep 1994