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AT&T lead-free solder paste for the cost effective manufacture of flip-chip silicon-on-silicon MCM

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2 Author(s)
Y. Degani ; Mater. & Technol. Integration Res. Lab., AT&T Bell Labs., Murray Hill, NJ, USA ; T. D. Dudderar

The development and implementation of a lead-free solder based Multichip Module (MCM) tile assembly technology called AT&T micro-Surface Mount Technology or AT&T μSMT is described. This novel technology exploits a unique Sn/Sb solder paste, batch processing and high speed automated flip-chip assembly to achieve high through-put and yield. As a result it is now possible to manufacture highly integrated MCM products in the numbers required to assure a competitive cost by permitting the distribution of capital expenses over a large production volume, and to do so without compromising their inherent advantages in performance and (small) size

Published in:

Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International

Date of Conference:

12-14 Sep 1994