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Fabrication and packaging of high-density multichip interconnect (HDMI) substrates

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1 Author(s)
Licari, J.J. ; Hughes Aircraft Co., Newport Beach, CA, USA

A process is described for the fabrication of high-density multichip interconnect (HDMI) substrates based on 6-in. diameter silicon or alumina wafers, a special low-coefficient-of-thermal-expansion polyimide dielectric, and aluminium metallization. Key issues in the assembly and hermetic packaging of large HDMI substrates, including tape-automated bonding interconnection, die attachment, and rework, are discussed. Large 2×4 in. and 4×4 in. aluminum nitride packages are being developed that are compatible with the silicon substrates, have a high thermal conductivity, and can be hermetically sealed

Published in:

Aerospace and Electronics Conference, 1989. NAECON 1989., Proceedings of the IEEE 1989 National

Date of Conference:

22-26 May 1989