Cart (Loading....) | Create Account
Close category search window
 

Superconducting integrated circuit fabrication with low temperature ECR-based PECVD SiO/sub 2/ dielectric films

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Sauvageau, J.E. ; Nat. Inst. of Stand. & Technol., Boulder, CO, USA ; Burroughs, C.J. ; Booi, P.A.A. ; Cromar, M.W.
more authors

A superconducting integrated circuit fabrication process has been developed to encompass a wide range of applications such as Josephson voltage standards, VLSI scale array oscillators, SQUIDs, and kinetic-inductance-based devices. An optimal Josephson junction process requires low temperature processing for all deposition and etching steps. This low temperature process involves an electron cyclotron resonance-based plasma-enhanced chemical vapor deposition of SiO/sub 2/ films for interlayer dielectrics. Experimental design and statistical process control techniques have been used to ensure high quality oxide films. Oxide and niobium etches include endpoint detection and controlled overetch of all films. An overview of the fabrication process is presented.<>

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:5 ,  Issue: 2 )

Date of Publication:

June 1995

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.