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Modeling of 3-D Vertical Interconnect Using Support Vector Machine Regression

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5 Author(s)
Lei Xia ; Dept. of Electron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu ; Jicheng Meng ; Ruimin Xu ; Bo Yan
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In this letter, the support vector machine (SVM) regression approach is introduced to model the three-dimensional (3-D) high density microwave packaging structure. The SVM is based on the structural risk minimization principle, which leads to a good generalization ability. With a 3-D vertical interconnect used as an example, the SVM regression model is electromagnetically developed with a set of training data and testing data, which is produced by the electromagnetic simulation. Experimental results suggest that the developed model performs with a good predictive ability in analyzing the electrical performance

Published in:

Microwave and Wireless Components Letters, IEEE  (Volume:16 ,  Issue: 12 )