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An Analytical Model for Thermal Stress Analysis of Multi-layered Microelectronic Packaging

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2 Author(s)
Yujun Wen ; Electronic Packaging Laboratory, Department of Civil, Structural and Environmental Engineering, University at Buffalo, SUNY, Buffalo, NY 14260 ; Cemal Basaran

Compared to numerical methods, analytical solutions can offer a faster and more accurate procedure for obtaining the interfacial stresses in laminated structures. An analytical model for thermal stress analysis of multi-layered thin stacks on a thick substrate under isothermal loading is proposed in this paper. This analytical approach considers each layer as a beam-type plate with orthotropic material properties. Highly sensitive Moire interferometry is used to validate the model. The strain field in the bi-material interfaces is obtained experimentally. The test data is in good agreement with the proposed analytical solution. Finite element analysis results are also compared with the analytical solution and the test data

Published in:

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis

Date of Conference:

27-29 June 2005