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An Ontology for Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications

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3 Author(s)
Morris, J.E. ; Dept. of Electr. & Comput. Eng., Portland State Univ., OR ; Jeahuck Lee ; Johan Liu

This paper is intended to provide an initial resource for researchers and practitioners entering the isotropic conductive adhesive (ICA) field, but may also prove useful to those with prior experience. It presents an historical overview of the issues confronted in ICA development and use in various electronics packaging application in place of soldering technology

Published in:

High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on

Date of Conference:

27-29 June 2005

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