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Mechanics of Interfacial Delamination in IC Packages Undergoing Solder Reflow

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1 Author(s)
Andrew A. O. Tay ; Nano/Microsystems Integration Laboratory, Department of Mechanical Engineering, National University of Singapore. Email:

When plastic packages undergo solder reflow after being subjected to moisture preconditioning, hygrothermal stresses are induced in the package. If these stresses are excessive popcorning failure will occur. It has been shown that popcorning failure is usually preceded by delamination of either the pad/encapsulant interface or the die-attach-layer/pad interface. Fracture mechanics methodology has been shown to be a useful technique for analysing and predicting the onset of delamination. This paper describes an investigation on the mechanics of delamination at interfaces in typical plastic IC packages

Published in:

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis

Date of Conference:

27-29 June 2005