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The 2004 International Electronics Manufacturing Initiative (iNEMI) Technology Roadmaps

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2 Author(s)
R. C. Pfahl ; International Electronics Manufacturing Initiative (iNEMI), 2214 Rock Hill Road, Suite 110m Hemdon, VA 20170 USA ; James McElroy

The tenth anniversary edition of the biennial roadmap is the first edition under our new name: International Electronics Manufacturing Initiative (iNEMI). The nineteen technology roadmaps identify future research, development, and implementation needs to continue the growth of the worldwide electronics industry. During this roadmap cycle, we consciously targeted participation from key Asian and European firms/organizations in order to help insure that the technology projections truly represent a global view. With this roadmap we established an international collaborative agreement with the IEEE / CPMT (Institute of Electrical and Electronics Engineers / Components, Packaging and Manufacturing Technology), while continuing our strong linkages with other international roadmapping organizations - ITRS, IPC, IMAPS, INSIC, SCC, and OIDA- and with USDC. The 2004 iNEMI Roadmap consists of over 1200 pages, with more than 470 participants from over 220 companies, universities and associations from 11 countries. This paper highlights technology needs, paradigm shifts, strategic concerns, and key recommendations from the roadmap. Emphasis is placed on the advanced packaging, sensors, system in package, and organic and ceramic substrate roadmap chapters. This roadmap has increased the focus on forecasting potentially disruptive technology in the 2012-2015 time frame such as the use of nanotechnology to address the projected end of Moore's law and the scaling of CMOS devices. This roadmap balances the market needs against the future technology capabilities. The 2004 iNEMI Roadmap is a valuable snapshot of our industry in the third millennium. The challenge now shifts to leveraging these findings for the good of the electronics manufacturing supply chain

Published in:

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis

Date of Conference:

27-29 June 2005