Reliability Study for Test Lands Targeting during Electrical Testing

Theoretical analysis and experimental observation of tolerance distribution in bed-of-nails fixture were made for its reliability in testing. A systematic, accurate and robust evaluating method for printed circuit board (PCB) positioning assessment in testing fixture was developed. Actual deformation of PCB could be obtained based upon a reasonable mode. The combined accuracy of the test lands position targeting (false failure rate or overlapping rate of probe/test lands) were estimated by Weibull model. Results will be helpful for reliability analysis of the PCB test fixtures