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Experiments on the Bonding Interface Vibration of Thermosonic Flip Chip

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3 Author(s)
Wang Fu-liang ; Coll. of Mech. & Electronical Eng., Central South Univ., Changsha ; Han Lei ; Zhong Jue

The vibrations of chip and tool tip during thermosonic flip chip bonding were studied. By measure the vibration of the chip and tool tip with a Doppler laser vibration measure system, the "suddenly velocity decrease" of chip was elucited. It is noticed that this means the bonding strength formed in the bonding interface. By analyzing the vibration displacement and frequency of the chip and comparing with the vibration displacement of the tool tip, it is noticed that the chip vibrates in a "stick-slip" state after the "suddenly velocity decrease", and the continued ultrasonic vibration may effect the formed bonding area, and suggest about the ultrasonic power supply pattern was obtained

Published in:

High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on

Date of Conference:

27-29 June 2005