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Apply Difference Analysis to Nano-Probing Technique for Reasoning Erratic Defect out in Integrated Circuits

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2 Author(s)
Garfield Shen ; Taiwan Semiconductor Manufacture Company, Ltd., Taiwan, 1, Nan-Ke North Rd., Tainan Science Park, Tainan, Taiwan 741-44, R.O.C. Phone: (886)-3-5636688 Fax: (886)-6-5052057. Email: cmshen@tsmc.com ; Kevin Chuang

The purpose of this paper is to present a novel deductive methodology, which is accomplished by applying difference analysis to nano-probing technique. This methodology would like to resolve the erratic device with a tailing failure or puzzling feature, but not only to check if the suspect had incorrect characteristic or mismatched transistor parameters

Published in:

2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Date of Conference:

3-7 July 2006