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Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly

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3 Author(s)
Yi-Shao Lai ; Adv. Semicond. Eng. Inc, Kaohsiung ; Tong Hong Wang ; Ching-Chun Wang

In this paper, the Taguchi optimization method is applied to obtain the optimal and robust design towards enhancement of board-level thermomechanical reliability of a package-on-package stacking assembly under an accelerated thermal cycling test condition. An L18(2 1times37) orthogonal array is arranged for the optimization of eight selected control factors of the assembly, including thickness of dies, molding compounds, and substrates, sizes of package and molding compound, and solder joint standoffs. The importance of each of these control factors is compared and ranked

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:29 ,  Issue: 4 )