By Topic

Comments on "Modeling of Metallic Carbon-Nanotube Interconnects for Circuit Simulations and a Comparison With Cu Interconnects for Sealed Technologies

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Hong Li ; Center for Microwave & RF Technol., Shanghai Jiao Tong Univ. ; Wen-Yan Yin ; Jun-Fa Mao

For original paper, see Raychowdhury and Roy, IEEE Trans. Comput.-Aided Design Integr. Circuits Syst., vol.25, no.1, p.58-65, 2006 January

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:25 ,  Issue: 12 )