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Scalable Model of On-Wafer Interconnects for High-Speed CMOS ICs

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5 Author(s)
Xiaomeng Shi ; Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ. ; Kiat Seng Yeo ; Jian-Guo Ma ; Do, A.V.
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This paper describes the development of an equivalent circuit model of on-wafer interconnects for high-speed CMOS integrated circuits. By strategically cascading two-pi blocks together, the lumped model can characterize the distributed effects. Besides, the elaborately proposed model characterizes the frequency-variant characteristics with frequency-independent components. Thus, the model can be easily plugged into commercial computer-aided design tools. By adopting a newly invented optimization algorithm, namely, particle swarm optimization (PSO), the model parameters are extracted and formulated as empirical expressions. Therein, with each set of the geometrical parameters, the interconnect behaviors can be accurately predicted. The accuracy of the model is validated by comparisons with the on-wafer measurements up to 30 GHz. Moreover, the scalability of the proposed model is also discussed

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:29 ,  Issue: 4 )

Date of Publication:

Nov. 2006

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