By Topic

Evaluate the dielectric thickness variation of thin-film microstrip line by time domain reflectometry

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Fang-Lin Chao ; Ind. Technol. Res. Inst., Hsinchu, Taiwan

The impedance distribution measured by time domain reflectometry is utilized in estimating the thickness variation of the dielectric layer in a thin-film microstrip line. The relationship between dielectric thickness and impedance variation is derived based on an approximate formula. Measurements are carried out and a maximum linear fitting algorithm is proposed to correct the series resistance effect in the time domain reflectometer (TDR) data

Published in:

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Date of Conference:

4-6 Oct 1993