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A three-dimensional mesh multiprocessor system using board-to-board free-space optical interconnects: COSINE-III

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3 Author(s)
Sakano, T. ; NTT Transmission Syst. Lab., Kanagawa, Japan ; Matsumoto, T. ; Noguchi, K.

A prototype multiprocessor system using board-to-board free-space optical interconnects distributed over the processor boards is constructed for the first time. The system consists of 64 processing units interconnected in a three-dimensional (3D) mesh network with the help of bi-directional free-space optical interconnects. Theoretical analysis of signal delay and wiring congestion characteristics in the 3-D mesh network using free-space optical interconnects concludes that the network is superior to that using a conventional backplane interconnects. In the prototype system, signal transmission of all 96 free-space optical interconnects is stable even after repeated extraction and insertion of the processor boards, and system operation without error for 100 h is performed. The system is also shown to be easy to extend to a larger and more flexible system

Published in:

Computer Design: VLSI in Computers and Processors, 1993. ICCD '93. Proceedings., 1993 IEEE International Conference on

Date of Conference:

3-6 Oct 1993