By Topic

Performance driven spacing algorithms using attractive and repulsive constraints for submicron LSI's

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Onozawa, A. ; NTT LSI Labs., Atsugi, Japan ; Chaudhary, K. ; Kuh, E.S.

This paper proposes one-dimensional spacing algorithms that minimize [maximize] the degree of separation [proximity] among the specified elements of a given integrated circuit layout. Number of problems on chip and MCM systems such as poor performance, higher crosstalk, lower yield etc. are related to the degree of separation [proximity]. The proposed algorithms utilize the attractive [repulsive] constraints to shrink [expand] the distances among the specified elements while keeping the layout free of any design rule errors. The spacing problem is reduced to a parametric linear programming problem and a network simplex algorithm is proposed for solving it. The proposed algorithms are implemented into a system called PERFECT for performance enhancement and crosstalk reduction. Given a routed design, PERFECT minimizes delay due to the coupled capacitance, which could contribute as much as 50-75% to the interconnect delay in near future. PERFECT utilizes the repulsive constraints between interconnect segments for the purpose. The experimental results show a significant delay improvement and the crosstalk reduction for submicron technologies

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:14 ,  Issue: 6 )