By Topic

Low-cost molded packaging for optical data links

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Robinson, S.D. ; AT&T Bell Labs., Breinigsville, PA, USA ; Acarlar, M.S. ; Chen, Y.C. ; Manzione, L.T.
more authors

In order to lower the cost of optical data link packaging, a new technology has been developed which integrates optical and electrical components in a single, sealed, transfer molded package. This technology utilizes leadframes for low cost and mass handling. Overmolding is used for package sealing and optical port alignment. A unique process, two-step transfer molding, allows for internal shielding, intermediate IC testing, ease of assembly, and IC package sealing. An injection-molded outer housing is used for connector insertion and external shielding (through the use of conductive plastics). The first application of this technology is a high performance optical transceiver package for the growing FDDI market (125 Mb/s). With a duplex MIC connector, this package conforms to an industry standard outline and pinout. The optical transceiver easily meets full FDDI specifications. The design integrates an LED, PIN, transmitter IC, receiver IC, and two capacitors in a single, overmolded package. The final assembly sequence was conceived using the latest Design For Simplicity (DFS) principles. This paper describes the design concept and prototype model performance results

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 2 )