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Low-cost molded packaging for optical data links

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6 Author(s)
S. D. Robinson ; AT&T Bell Labs., Breinigsville, PA, USA ; M. S. Acarlar ; Y. C. Chen ; L. T. Manzione
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In order to lower the cost of optical data link packaging, a new technology has been developed which integrates optical and electrical components in a single, sealed, transfer molded package. This technology utilizes leadframes for low cost and mass handling. Overmolding is used for package sealing and optical port alignment. A unique process, two-step transfer molding, allows for internal shielding, intermediate IC testing, ease of assembly, and IC package sealing. An injection-molded outer housing is used for connector insertion and external shielding (through the use of conductive plastics). The first application of this technology is a high performance optical transceiver package for the growing FDDI market (125 Mb/s). With a duplex MIC connector, this package conforms to an industry standard outline and pinout. The optical transceiver easily meets full FDDI specifications. The design integrates an LED, PIN, transmitter IC, receiver IC, and two capacitors in a single, overmolded package. The final assembly sequence was conceived using the latest Design For Simplicity (DFS) principles. This paper describes the design concept and prototype model performance results

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:18 ,  Issue: 2 )