Cart (Loading....) | Create Account
Close category search window
 

Micromachined silicon as a module platform for multiple fiber I/Os

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Haugsjaa, P.O. ; GTE Lab. Inc., Waltham, MA, USA

Progress toward the implementations of low-cost and reliable multiple optical fiber I/Os (input/outputs) for high-speed optoelectronics modules based on the use of micromachined silicon platforms is described. This approach, which makes use of conventional silicon processing technology, has built-in capabilities for reducing the labor requirements for packaging modules with multiple optical I/Os. In addition, it provides a natural means of extension to the fabrication of multitechnology modules (MTMs) for future-generation microwave systems, antennas, computers, and telecommunications systems. The assembly tolerances that are possible with this technology and the close connection that silicon waferboard has to existing silicon processing technology make it practical module level packaging technology for multiple optical fiber I/Os.<>

Published in:

Antennas and Propagation Society International Symposium, 1993. AP-S. Digest

Date of Conference:

June 28 1993-July 2 1993

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.