Referenced Items are not available for this document.
Sensor assembly is one of the key technologies to improve the cost performance of silicon sensors. As a technology to achieve this aim, polysilicon sacrificial layer etching technology is presented. As its applications, a microdiaphragm pressure sensor with a reference pressure chamber and an integrated pyroelectric infrared sensor with a thermal isolated structure are also presented. Fabrication of a micro optical chopper is shown, and the future style of sensor devices is proposed.<
Published in:
Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
Date of Conference: 11-14 Dec. 1994
- Page(s):
- 127 - 130
- Meeting Date :
- 11 Dec 1994-14 Dec 1994
- ISSN :
- 0163-1918
- Print ISBN:
- 0-7803-2111-1
- INSPEC Accession Number:
- 4886222
- Conference Location :
- San Francisco, CA, USA
- Digital Object Identifier :
- 10.1109/IEDM.1994.383448
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
