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3D modeling of rapid thermal processors for design optimization of a new flexible RTP system

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5 Author(s)
Yunzhong Chen ; Dept. of Electr. Eng., Stanford Univ., CA, USA ; Booth, L. ; Schaper, C. ; Khuri-Yakub, B.T.
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A "virtual reactor" methodology for optimal design of a rapid thermal processor (RTP) to obtain the best possible wafer temperature uniformity is described in this paper. Given the equipment configuration, e.g., the lamp array, a three-dimensional simulator is used to predict the wafer temperature profiles for various lamp array designs for different processing conditions. The only experimental input needed is the spatial light flux distribution of the individual tungsten-halogen bulb which forms the lamp array. The simulations show that the flux distribution of the heating source significantly affects the temperature pattern of the wafer. Based on these results, a new RTP system with an adjustable reflector and multivariable control has been designed.<>

Published in:

Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International

Date of Conference:

11-14 Dec. 1994