Cart (Loading....) | Create Account
Close category search window

A comprehensive study of numerical anisotropy and dispersion in 3-D TLM meshes

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Berini, Pierre ; Dept. de Genie Electr. et Inf., Ecole Polytech., Montreal, Que., Canada ; Ke Wu

This paper presents a comprehensive analysis of the numerical anisotropy and dispersion of 3-D TLM meshes constructed using several generalized symmetrical condensed TLM nodes. The dispersion analysis is performed in isotropic lossless, isotropic lossy and anisotropic lossless media and yields a comparison of the simulation accuracy for the different TLM nodes. The effect of mesh grading on the numerical dispersion is also determined. The results compare meshes constructed with Johns' symmetrical condensed node (SCN), two hybrid symmetrical condensed nodes (HSCN) and two frequency domain symmetrical condensed nodes (FDSCN). It has been found that under certain circumstances, the time domain nodes may introduce numerical anisotropy when modelling isotropic media

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:43 ,  Issue: 5 )

Date of Publication:

May 1995

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.