By Topic

Full-wave characterization of a through hole via in multi-layered packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Show-Gwo Hsu ; Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan ; Wu, Ruey-Beei

A full-wave analysis is presented for the propagation characteristics of a through hole via connecting two semi-infinitely long transmission lines in multi-layered packaging environment. The current distribution on the via and a section of transmission line is solved under the thin wire approximation by the moment method and the scattering parameters are extracted by the matrix pencil method. The Green's function in multilayer packaging environment is derived by applying the image theory and evaluated by the help of the Poisson summation formula. Numerical results are included to investigate the frequency dependent propagation characteristics for via structures with various geometrical parameters, e.g., the via height, wire diameter, and distance between two ground planes. The excitation of the radial waves due to the current distribution on the via is also discussed in detail

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:43 ,  Issue: 5 )