Cart (Loading....) | Create Account
Close category search window

Imposing tight specifications on analog IC's through simultaneous placement and module optimization

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Charbon, E. ; Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA ; Malavasi, E. ; Pandini, D. ; Sangiovanni-Vincentelli, A.

Techniques are presented for simultaneous placement and module optimization for analog ICs. An algorithmic approach to module generation provides alternative sets of modules, optimized with respect to performance but with different trade-offs among area, parasitics and matching. A simulated annealing algorithm performs the placement, selecting among the available configurations the one that best fulfils all performance and geometric requirements. Compared to standard approaches, the flexibility of placement is considerably increased, thus allowing the enforcement of tighter specifications

Published in:

Custom Integrated Circuits Conference, 1994., Proceedings of the IEEE 1994

Date of Conference:

1-4 May 1994

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.