Referenced Items are not available for this document.
Coupling between two microstrip lines through a rectangular slot in a common, electrically thick ground plate is analyzed. The results are applied to examine the properties of a vertical, noncontact line-to-line transition. An efficient and accurate design model is constructed. The model allows insight into the coupling characteristics of the device with minimal computational effort. Measured results are used to verify the efficacy of the solution. Analytical or highly convergent forms of the model parameters are derived whenever possible
Published in:
Microwave Theory and Techniques, IEEE Transactions on
(Volume:43
,
Issue:
4
)
Date of Publication: Apr 1995
- Page(s):
- 753 - 759
- ISSN :
- 0018-9480
- INSPEC Accession Number:
- 4953300
- Digital Object Identifier :
- 10.1109/22.375221
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Apr 1995
- Sponsored by :
- IEEE Microwave Theory and Techniques Society
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