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A high-density modular power processor for distributed military power systems

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2 Author(s)
Walters, M.M. ; IBM Corp., Oswego, NY, USA ; Polivka, W.M.

A high-density power processor in a SEM (standard electronic module) Format-E package is described. The power converter features a full-bridge PWM (pulse-width modulated) topology that uses transition resonance to achieve zero-voltage switching. The switching sequence of the phase-shifted topology simplifies the MOSFET drive circuitry. The converter's tolerance to low magnetizing inductance reduces the volume required for the power transformer. A low-bandwidth control loop regulates the output currents of parallel units, providing excellent DC load-sharing characteristics while allowing each unit to respond to dynamic loads with its own high-bandwidth loop. The parallel modules are self-synchronizing in frequency and can be synchronized to an external clock. A high-density packaging approach is used

Published in:

Applied Power Electronics Conference and Exposition, 1989. APEC' 89. Conference Proceedings 1989., Fourth Annual IEEE

Date of Conference:

13-17 Mar 1989