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Thermal analysis of integrated-circuit chips using thermographic imaging techniques

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1 Author(s)
Dong-Ho Lee ; Dept. of Control & Instrum. Eng., Hanyang Univ., Ansan, South Korea

This paper presents the analysis of the thermal gradients on the substrate of an integrated-circuit chip (telephone line interface chip) using thermographic imaging techniques. After taking the chip thermal image using a thermal camera and doing temperature calibration, an isothermal contour map of the chip region is drawn by digital image-processing techniques proposed in this paper. By overlaying the layout mask on the isothermal contour map of the chip region, each region of the chip is easily identified. This information is of great assistance to the designer while laying out the components on the chip

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Instrumentation and Measurement, IEEE Transactions on  (Volume:43 ,  Issue: 6 )