By Topic

A micromachined array probe card-characterization

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
M. Beiley ; IBM Corp., Essex Junction, VT, USA ; J. Leung ; S. S. Wong

An array probe card fabricated on a silicon wafer for high performance and high pin count applications is characterized. The probe card is capable of providing a very large number of probe tips (>1000) that offer a contact resistance of less than 2 Ω. A novel approach to replacing the mechanical scrubbing motion with an electrical breakdown process is presented. The probe card is capable of operating at elevated temperatures for extended periods of time, offers alternative probe tip configurations, and is capable of probing a variety of pad metals. Controlled impedance (50 Ω) striplines that run all the way to the probe tips offer a delay time of 68 ps/cm, 3 GHz bandwidth, and far-end cross-talk of -49 dB/cm at a pitch of 32 μm

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:18 ,  Issue: 1 )